XCZU17EG-3FFVC1760E
RoHS 
RoHS compliant
RoHS compliantPackage 1760-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A53 1760FCBGA
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Technical Details
Supply Chain
Factory Lead Time 11 Weeks
Physical
Package / Case 1760-BBGA, FCBGA
Technical
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 512
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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