XCZU17EG-3FFVB1517E
RoHS 
RoHS compliant
RoHS compliantPackage 1517-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC FPGA 644 I/O 1517FCBGA
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Technical Details
Compliance
RoHS Status ROHS3 Compliant
Technical
Primary Attributes Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, WDT
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
RAM Size 256KB
Speed 600MHz, 667MHz, 1.5GHz
Number of I/O 644
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
HTS Code 8542.31.00.01
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
Series Zynq? UltraScale+? MPSoC EG
Published 2016
Packaging Tray
Operating Temperature 0°C~100°C TJ
Physical
Package / Case 1517-BBGA, FCBGA
Supply Chain
Factory Lead Time 11 Weeks
Alternative Model
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