XCZU17EG-1FFVB1517I
RoHS 
RoHS compliant
RoHS compliantPackage 1517-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
MCU FPGA Active ROHS3Compliant 2016 System On Chip (SOC) IC -40C~100C TJ 256KB 500MHz 600MHz 1.2GHz
PDF
/
Inventory: 2463
Minimum: /
The more specific your information, the faster response you will get.
Please complete the following form with the details of your request part and
contact information to get a quote.
Quotation Consultation
Technical Details
Compliance
RoHS Status ROHS3 Compliant
Technical
Primary Attributes Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, WDT
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
RAM Size 256KB
Speed 500MHz, 600MHz, 1.2GHz
Number of I/O 644
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
HTS Code 8542.31.00.01
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
Series Zynq? UltraScale+? MPSoC EG
Published 2016
Packaging Tray
Operating Temperature -40°C~100°C TJ
Physical
Package / Case 1517-BBGA, FCBGA
Supply Chain
Factory Lead Time 11 Weeks
Recommended For You
XCZU17EG-1FFVB1517I+price,XCZU17EG-1FFVB1517I+datasheet,XCZU17EG-1FFVB1517I+in stock,buy+XCZU17EG-1FFVB1517I,finder+XCZU17EG-1FFVB1517I,XCZU17EG-1FFVB1517I+tutorials,XCZU17EG-1FFVB1517I+download