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XC7Z100-1FFG900I

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 900FCBGA
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Buying Options
Total Price: USD $267.28
Unit Price: USD $267.2768
≥1 USD $267.2768
≥10 USD $239.62705
Inventory: 502
Minimum: 1
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Technical Details

Technical

Base Part Number XC7Z100
JESD-30 Code S-PBGA-B900
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 212
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 444K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Time@Peak Reflow Temperature-Max (s) 30
Frequency 667MHz
Terminal Pitch 1mm
Supply Voltage 1V
Peak Reflow Temperature (Cel) 245
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.39.00.01
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
ECCN Code 3A991.D
Number of Terminations 900
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
JESD-609 Code e1
Series Zynq?-7000
Published 2010
Packaging Tube
Operating Temperature -40°C~100°C TJ

Dimensions

Height Seated (Max) 3.35mm
Length 31mm
Width 31mm

Compliance

Radiation Hardening No
RoHS Status ROHS3 Compliant

Physical

Surface Mount YES
Package / Case 900-BBGA, FCBGA

Supply Chain

Factory Lead Time 10 Weeks

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