XC7Z045-L2FFG676I
RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A9 800MHZ 676FCBGA
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Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 676-BBGA, FCBGA
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq?-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Propagation Delay 100 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
Number of Registers 437200
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Dimensions
Height Seated (Max) 3.37mm
Length 27mm
Width 27mm
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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