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XC7Z045-3FFV676E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 1GHZ 676FCBGA
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Package / Case 676-BBGA, FCBGA

Technical

Operating Temperature 0°C~100°C TJ
Packaging Bulk
Published 2009
Series Zynq?-7000
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of I/O 130
Speed 1GHz
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Kintex?-7 FPGA, 350K Logic Cells

Compliance

RoHS Status ROHS3 Compliant

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