XC7Z045-2FFG676I
RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL ROMless BOTTOM MCU FPGA System On Chip (SOC) IC -40C~100C TJ 256KB 800MHz 1V
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Buying Options
Total Price: USD $186.54
Unit Price: USD $186.54219
≥1 USD $186.54219
≥10 USD $179.020328
Inventory: 19
Minimum: 1
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Technical Details
Compliance
RoHS Status ROHS3 Compliant
Radiation Hardening No
Dimensions
Length 27mm
Height Seated (Max) 3.37mm
Technical
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
RAM (words) 256000
Speed Grade -2
Boundary Scan YES
Core Architecture ARM
Data Bus Width 32b
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Memory Type ROMless
RAM Size 256KB
Number of I/O 130
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Supply Voltage-Max (Vsup) 1.05V
Operating Supply Voltage 1V
JESD-30 Code S-PBGA-B676
Base Part Number XC7Z045
Time@Peak Reflow Temperature-Max (s) 30
Frequency 800MHz
Terminal Pitch 1mm
Supply Voltage 1V
Peak Reflow Temperature (Cel) 245
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.39.00.01
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code 3A991.D
Number of Terminations 676
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
JESD-609 Code e1
Series Zynq?-7000
Published 2009
Packaging Tray
Operating Temperature -40°C~100°C TJ
Physical
Surface Mount YES
Package / Case 676-BBGA, FCBGA
Contact Plating Copper, Silver, Tin
Supply Chain
Factory Lead Time 10 Weeks
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