XC7Z045-2FF676I
RoHS
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Package 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
MPU Zynq-7000 RISC 32-Bit 800MHz 1V 676-Pin FCBGA
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Technical Details
Compliance
RoHS Status Non-RoHS Compliant
Technical
Bus Compatibility CAN, ETHERNET, I2C, PCI, SPI, UART, USB
Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
RAM (words) 256000
Boundary Scan YES
Core Architecture ARM
Data Bus Width 32b
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Memory Type ROMless
RAM Size 256KB
Number of I/O 130
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
JESD-30 Code S-PBGA-B676
Frequency 800MHz
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.39.00.01
Number of Terminations 676
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
Pbfree Code no
Series Zynq?-7000
Published 2010
Packaging Tray
Operating Temperature -40°C~100°C TJ
Physical
Surface Mount YES
Package / Case 676-BBGA, FCBGA
Supply Chain
Factory Lead Time 10 Weeks
Alternative Model
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