XC7Z045-1FFG676C
RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
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Buying Options
Total Price: USD $621.96
Unit Price: USD $621.955
≥1 USD $621.955
≥10 USD $586.75
≥100 USD $553.53774
Inventory: 126
Minimum: 1
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Technical Details
Technical
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
JESD-30 Code S-PBGA-B676
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.39.00.01
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code 3A991.D
Number of Terminations 676
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
JESD-609 Code e1
Series Zynq?-7000
Published 2009
Packaging Tray
Operating Temperature 0°C~85°C TJ
Dimensions
Height Seated (Max) 3.37mm
Length 27mm
Compliance
Radiation Hardening No
RoHS Status ROHS3 Compliant
Physical
Surface Mount YES
Package / Case 676-BBGA, FCBGA
Contact Plating Copper, Silver, Tin
Supply Chain
Factory Lead Time 10 Weeks
Alternative Model
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