XC7Z045-1FBG676C
RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
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Buying Options
Total Price: USD $304.1
Unit Price: USD $304.095622
≥1 USD $304.095622
≥10 USD $286.882661
≥100 USD $270.64402
≥500 USD $255.324548
≥1000 USD $240.872217
Inventory: 1140
Minimum: 1
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Technical Details
Compliance
RoHS Status ROHS3 Compliant
Radiation Hardening No
Dimensions
Length 27mm
Height Seated (Max) 2.54mm
Technical
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
RAM (words) 256000
Speed Grade -1
Boundary Scan YES
Core Architecture ARM
Number of Logic Elements/Cells 190000
Data Bus Width 32b
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Memory Type ROMless
RAM Size 256KB
Number of I/O 130
Min Supply Voltage 1.2V
Max Supply Voltage 3.3V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Base Part Number XC7Z045
Time@Peak Reflow Temperature-Max (s) 30
Frequency 667MHz
Terminal Pitch 1mm
Supply Voltage 1V
Peak Reflow Temperature (Cel) 245
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.39.00.01
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
ECCN Code 3A991.D
Number of Terminations 676
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e1
Series Zynq?-7000
Published 2009
Packaging Tray
Operating Temperature 0°C~85°C TJ
Physical
Number of Pins 676
Surface Mount YES
Package / Case 676-BBGA, FCBGA
Contact Plating Copper, Silver, Tin
Supply Chain
Factory Lead Time 10 Weeks
Alternative Model
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