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XC7Z035-3FFG900E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 800MHZ 900FCBGA
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Buying Options
Total Price: USD $144.57
Unit Price: USD $144.5653
≥1 USD $144.5653
≥10 USD $139.7469
≥100 USD $125.2898
Inventory: 1163
Minimum: 1
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Technical

Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Number of Registers 343800
Primary Attributes Kintex?-7 FPGA, 275K Logic Cells
RAM (words) 256000
Speed Grade 3
Boundary Scan YES
Core Architecture ARM
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Propagation Delay 90 ps
Peripherals DMA
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size 256KB
Number of I/O 130
Min Supply Voltage 950mV
Max Supply Voltage 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
JESD-30 Code S-PBGA-B900
Time@Peak Reflow Temperature-Max (s) 30
Frequency 800MHz
Terminal Pitch 1mm
Supply Voltage 1V
Peak Reflow Temperature (Cel) 245
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations 900
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
JESD-609 Code e1
Series Zynq?-7000
Published 2010
Packaging Tray
Operating Temperature 0°C~100°C TJ

Physical

Package / Case 900-BBGA, FCBGA
Mount Surface Mount
Contact Plating Copper, Silver, Tin

Supply Chain

Factory Lead Time 10 Weeks

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