XC7Z035-3FBG676E
RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A9 800MHZ 676FCBGA
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Buying Options
Total Price: USD $148.88
Unit Price: USD $148.88115
≥1 USD $148.88115
≥10 USD $143.91835
≥100 USD $129.02995
Inventory: 1134
Minimum: 1
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Technical Details
Compliance
RoHS Status ROHS3 Compliant
Dimensions
Width 27mm
Length 27mm
Height Seated (Max) 2.54mm
Technical
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Number of Registers 343800
Primary Attributes Kintex?-7 FPGA, 275K Logic Cells
RAM (words) 256000
Speed Grade 3
Boundary Scan YES
Core Architecture ARM
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Propagation Delay 110 ps
Peripherals DMA
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size 256KB
Number of I/O 130
Min Supply Voltage 950mV
Max Supply Voltage 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
JESD-30 Code S-PBGA-B676
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Frequency 800MHz
Terminal Pitch 1mm
Supply Voltage 1V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Number of Terminations 676
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e1
Series Zynq?-7000
Published 2010
Packaging Tray
Operating Temperature 0°C~100°C TJ
Physical
Package / Case 676-BBGA, FCBGA
Mount Surface Mount
Contact Plating Copper, Silver, Tin
Supply Chain
Factory Lead Time 10 Weeks
Alternative Model
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