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XC7Z035-2FFG900E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 800MHZ 900FCBGA
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Buying Options
Total Price: USD $357.97
Unit Price: USD $357.9714
≥1 USD $357.9714
Inventory: 403
Minimum: 1
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Width 31mm
Length 31mm
Height Seated (Max) 3.35mm

Technical

Number of Registers 343800
Primary Attributes Kintex?-7 FPGA, 275K Logic Cells
Speed Grade 2
Boundary Scan YES
Core Architecture ARM
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Propagation Delay 100 ps
Peripherals DMA
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size 256KB
Number of I/O 130
Min Supply Voltage 950mV
Max Supply Voltage 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
JESD-30 Code S-PBGA-B900
Time@Peak Reflow Temperature-Max (s) 30
Frequency 800MHz
Terminal Pitch 1mm
Supply Voltage 1V
Peak Reflow Temperature (Cel) 245
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code 3A991.D
Number of Terminations 900
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
JESD-609 Code e1
Series Zynq?-7000
Published 2010
Packaging Tray
Operating Temperature 0°C~100°C TJ

Physical

Package / Case 900-BBGA, FCBGA
Mount Surface Mount
Contact Plating Copper, Silver, Tin

Supply Chain

Factory Lead Time 10 Weeks

Alternative Model

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