XC7Z035-2FBG676E
RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 800MHz 1V
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Buying Options
Total Price: USD $483.26
Unit Price: USD $483.2612
≥1 USD $483.2612
Inventory: 307
Minimum: 1
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Technical Details
Compliance
RoHS Status ROHS3 Compliant
Dimensions
Width 27mm
Length 27mm
Height Seated (Max) 2.54mm
Technical
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Primary Attributes Kintex?-7 FPGA, 275K Logic Cells
RAM (words) 256000
Boundary Scan YES
Core Architecture ARM
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size 256KB
Number of I/O 130
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Supply Voltage-Min (Vsup) 0.95V
Supply Voltage-Max (Vsup) 1.05V
JESD-30 Code S-PBGA-B676
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Frequency 800MHz
Terminal Pitch 1mm
Supply Voltage 1V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.39.00.01
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
ECCN Code 3A991.D
Number of Terminations 676
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e1
Series Zynq?-7000
Published 2010
Packaging Tray
Operating Temperature 0°C~100°C TJ
Physical
Surface Mount YES
Package / Case 676-BBGA, FCBGA
Supply Chain
Factory Lead Time 10 Weeks
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