XC7Z035-1FBG676C
RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
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Buying Options
Total Price: USD $1110.12
Unit Price: USD $1110.1168
≥1 USD $1110.1168
≥10 USD $1047.28
≥100 USD $988
≥500 USD $932.07547
Inventory: 608
Minimum: 1
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Technical Details
Compliance
RoHS Status ROHS3 Compliant
Dimensions
Width 27mm
Length 27mm
Height Seated (Max) 2.54mm
Technical
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Number of Registers 343800
Primary Attributes Kintex?-7 FPGA, 275K Logic Cells
RAM (words) 256000
Speed Grade 1
Boundary Scan YES
Core Architecture ARM
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Propagation Delay 120 ps
Peripherals DMA
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size 256KB
Number of I/O 130
Min Supply Voltage 950mV
Max Supply Voltage 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
JESD-30 Code S-PBGA-B676
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Frequency 667MHz
Supply Voltage 1V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Number of Terminations 676
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e1
Series Zynq?-7000
Published 2010
Packaging Tray
Operating Temperature 0°C~85°C TJ
Physical
Package / Case 676-BBGA, FCBGA
Mount Surface Mount
Contact Plating Copper, Silver, Tin
Supply Chain
Factory Lead Time 10 Weeks
Alternative Model
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