XC7Z030-3FBG484E
RoHS 
RoHS compliant
RoHS compliantPackage 484-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 1GHz 1V
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Buying Options
Total Price: USD $160.37
Unit Price: USD $160.3657
≥1 USD $160.3657
≥10 USD $143.7768
Inventory: 1153
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Contact Plating Copper, Silver, Tin
Package / Case 484-BBGA, FCBGA
Surface Mount YES
Number of Pins 484
Technical
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq?-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 1GHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z030
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -3
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Dimensions
Height Seated (Max) 2.54mm
Length 23mm
Compliance
Radiation Hardening No
RoHS Status ROHS3 Compliant
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