XC7Z030-1FFG676C
RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~85C TJ 256KB 667MHz 1V
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Buying Options
Total Price: USD $343.2
Unit Price: USD $343.2
≥1 USD $343.2
Inventory: 135
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676
Technical
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series Zynq?-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z030
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Dimensions
Height Seated (Max) 3.24mm
Length 27mm
Compliance
Radiation Hardening No
RoHS Status ROHS3 Compliant
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