M2S100-FC1152
RoHS
/
Package 1152-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Obsolete System On Chip (SOC) IC 0C~85C TJ 512KB 166MHz 1.2V
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Technical Details
Compliance
RoHS Status Non-RoHS Compliant
Dimensions
Width 35mm
Length 35mm
Height Seated (Max) 2.9mm
Technical
Flash Size 512KB
Number of Logic Cells 99512
Primary Attributes FPGA - 100K Logic Modules
Core Architecture ARM
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs 574
Architecture MCU, FPGA
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DDR, PCIe, SERDES
Core Processor ARM? Cortex?-M3
RAM Size 64KB
Number of I/O 574
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Supply Voltage-Min (Vsup) 1.14V
Power Supplies 1.2V
Supply Voltage-Max (Vsup) 1.26V
Qualification Status Not Qualified
Number of Outputs 574
JESD-30 Code S-PBGA-B1152
Base Part Number M2S100
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Frequency 166MHz
Terminal Pitch 1mm
Supply Voltage 1.2V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Field Programmable Gate Arrays
Terminal Finish Tin/Lead (Sn/Pb)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e0
Series SmartFusion?2
Published 2009
Packaging Tray
Operating Temperature 0°C~85°C TJ
Physical
Surface Mount YES
Package / Case 1152-BBGA, FCBGA
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