M2S090-1FCS325
RoHS
/
Package 325-TFBGA, CSPBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~85C TJ 512KB 166MHz 1.2V
PDF
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Buying Options
Total Price: USD $474
Unit Price: USD $474.001539
≥1 USD $474.001539
≥176 USD $189.12981
≥528 USD $182.809509
≥1056 USD $179.687433
Inventory: 1238
Minimum: 1
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Technical Details
Compliance
RoHS Status Non-RoHS Compliant
Dimensions
Width 11mm
Length 13.5mm
Height Seated (Max) 1.16mm
Technical
Flash Size 512KB
Number of Logic Cells 86316
Primary Attributes FPGA - 90K Logic Modules
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs 180
Architecture MCU, FPGA
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DDR, PCIe, SERDES
Core Processor ARM? Cortex?-M3
RAM Size 64KB
Speed 166MHz
Number of I/O 180
Supply Voltage-Min (Vsup) 1.14V
Power Supplies 1.2V
Supply Voltage-Max (Vsup) 1.26V
Qualification Status Not Qualified
Number of Outputs 180
JESD-30 Code R-PBGA-B325
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Reach Compliance Code not_compliant
Terminal Pitch 0.5mm
Supply Voltage 1.2V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Additional Feature LG-MIN, WD-MIN
Terminal Finish Tin/Lead (Sn/Pb)
Number of Terminations 325
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e0
Series SmartFusion?2
Published 2015
Packaging Tray
Operating Temperature 0°C~85°C TJ
Physical
Surface Mount YES
Package / Case 325-TFBGA, CSPBGA
Supply Chain
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 10 Weeks
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