M2S050T-FG896
RoHS
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Package 896-BGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
FPGA SmartFusion2 Family 48672 Cells 65nm (CMOS) Technology 1.2V 896-Pin FBGA
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Technical Details
Supply Chain
Factory Lead Time 5 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Physical
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)
Technical
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion?2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Base Part Number M2S050
Operating Supply Voltage 1.2V
Memory Size 256kB
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM? Cortex?-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Data Rate 667 Mbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 56340
Max Frequency 400MHz
Number of Logic Blocks (LABs) 4695
Primary Attributes FPGA - 50K Logic Modules
Flash Size 256KB
Compliance
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Alternative Model
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