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M2S050T-1FG896I

Microsemi Corporation
RoHS
/
Package 896-BGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description FPGA SmartFusion2 Family 48672 Cells 65nm Technology 1.2V 896-Pin FBGA
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Technical Details

Compliance

RoHS Status Non-RoHS Compliant

Technical

Flash Size 256KB
Primary Attributes FPGA - 50K Logic Modules
Core Architecture ARM
Architecture MCU, FPGA
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DDR, PCIe, SERDES
Core Processor ARM? Cortex?-M3
RAM Size 64KB
Speed 166MHz
Number of I/O 377
Min Supply Voltage 1.14V
Max Supply Voltage 1.26V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Operating Supply Voltage 1.2V
Base Part Number M2S050T
Frequency 166MHz
Min Operating Temperature -40°C
Max Operating Temperature 100°C
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
Series SmartFusion?2
Published 2009
Packaging Tray
Operating Temperature -40°C~100°C TJ

Physical

Supplier Device Package 896-FBGA (31x31)
Number of Pins 896
Package / Case 896-BGA

Supply Chain

Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 8 Weeks

Alternative Model

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