A2F500M3G-FG484M
RoHS
/
Package 484-BGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC FPGA 500K GATES 512KB 484FBGA
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Technical Details
Supply Chain
Factory Lead Time 12 Weeks
Physical
Package / Case 484-BGA
Surface Mount YES
Technical
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion?
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number A2F500M3G
JESD-30 Code S-PBGA-B484
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 41, FPGA - 128
RAM Size 64KB
Core Processor ARM? Cortex?-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 11520 CLBS, 500000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Dimensions
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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