A2F200M3F-1FG256I
RoHS
/
Package 256-LBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC FPGA 200K GATES 256KB 256-BGA
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Technical Details
Compliance
RoHS Status Non-RoHS Compliant
Radiation Hardening No
Dimensions
Width 17mm
Length 17mm
Height Seated (Max) 1.7mm
Technical
Flash Size 256KB
Primary Attributes ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Logic Blocks (LABs) 8
Number of Gates 200000
Core Architecture ARM
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Architecture MCU, FPGA
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals DMA, POR, WDT
Core Processor ARM? Cortex?-M3
RAM Size 64KB
Number of I/O MCU - 25, FPGA - 66
Operating Supply Current 3mA
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Supply Voltage-Min (Vsup) 1.425V
Supply Voltage-Max (Vsup) 1.575V
Number of Outputs 66
Base Part Number A2F200
Time@Peak Reflow Temperature-Max (s) 20
Frequency 100MHz
Terminal Pitch 1mm
Supply Voltage 1.5V
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Field Programmable Gate Arrays
Terminal Finish Tin/Lead (Sn/Pb)
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e0
Series SmartFusion?
Published 2009
Packaging Tray
Operating Temperature -40°C~100°C TJ
Physical
Number of Pins 256
Surface Mount YES
Package / Case 256-LBGA
Supply Chain
Factory Lead Time 12 Weeks
Alternative Model
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