A2F060M3E-FG256M
RoHS
/
Package 256-LBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
IC FPGA 60K GATES 128KB 256FBGA
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Technical Details
Physical
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Technical
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion?
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Frequency 80MHz
Base Part Number A2F060M3E
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 26, FPGA - 66
Speed 80MHz
RAM Size 16KB
Core Processor ARM? Cortex?-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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