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A2F060M3E-1CS288I

Microsemi Corporation
RoHS
/
Package 288-TFBGA, CSPBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description IC FPGA 60K GATES 128KB 288-CSP
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Technical Details

Supply Chain

Factory Lead Time 99 Weeks

Physical

Package / Case 288-TFBGA, CSPBGA
Supplier Device Package 288-CSP (11x11)

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion?
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 100MHz
Base Part Number A2F060M3E
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 28, FPGA - 68
Speed 100MHz
RAM Size 16KB
Core Processor ARM? Cortex?-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Max Frequency 100MHz
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB

Compliance

RoHS Status Non-RoHS Compliant

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