5CSXFC2C6U23A7N
RoHS 
RoHS compliant
RoHS compliantPackage 672-FBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~125C TJ 64KB 700MHz 1.11.2/3.32.5V
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Technical Details
Supply Chain
Factory Lead Time 8 Weeks
Physical
Package / Case 672-FBGA
Surface Mount YES
Technical
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Automotive, AEC-Q100, Cyclone? V SE
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 672
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B672
Number of Outputs 145
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.13V
Power Supplies 1.11.2/3.32.5V
Supply Voltage-Min (Vsup) 1.07V
Number of I/O MCU - 181, FPGA - 145
Speed 700MHz
RAM Size 64KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA, POR, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Number of Inputs 145
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Elements
Number of Logic Cells 25000
Dimensions
Height Seated (Max) 1.85mm
Length 23mm
Width 23mm
Compliance
RoHS Status RoHS Compliant
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