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5CSEBA4U23C8SN

Intel
RoHS
RoHS RoHS compliant
Package 672-FBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~85C TJ 64KB 600MHz 1.11.2/3.32.5V
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Buying Options
Total Price: USD $112.49
Unit Price: USD $112.494769
≥1 USD $112.494769
≥200 USD $43.534668
≥500 USD $43.534668
≥1000 USD $41.248088
Inventory: 2272
Minimum: 1
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Technical Details

Compliance

RoHS Status RoHS Compliant

Dimensions

Width 23mm
Length 23mm
Height Seated (Max) 1.85mm

Technical

Number of Logic Cells 40000
Primary Attributes FPGA - 40K Logic Elements
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs 145
Architecture MCU, FPGA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, POR, WDT
Core Processor Single ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size 64KB
Speed 600MHz
Number of I/O MCU - 181, FPGA - 145
Supply Voltage-Min (Vsup) 1.07V
Power Supplies 1.11.2/3.32.5V
Supply Voltage-Max (Vsup) 1.13V
Qualification Status Not Qualified
Number of Outputs 145
JESD-30 Code S-PBGA-B672
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Terminal Pitch 0.8mm
Supply Voltage 1.1V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Number of Terminations 672
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
Series Cyclone? V SE
Published 2018
Packaging Tray
Operating Temperature 0°C~85°C TJ

Physical

Surface Mount YES
Package / Case 672-FBGA

Supply Chain

Factory Lead Time 8 Weeks

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