5ASXMB5E4F31C4N
RoHS 
RoHS compliant
RoHS compliantPackage 896-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~85C TJ 64KB 670MHz 1.1V
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Buying Options
Total Price: USD $676.69
Unit Price: USD $676.68765
≥1 USD $676.68765
≥10 USD $638.38458
≥100 USD $602.2496
≥500 USD $568.16
≥1000 USD $536
≥3000 USD $505.66038
Inventory: 7988
Minimum: 1
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Technical Details
Supply Chain
Factory Lead Time 26 Weeks
Physical
Package / Case 896-BBGA, FCBGA
Surface Mount YES
Technical
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Arria V SX
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number 5ASXMB5
JESD-30 Code S-PBGA-B896
Supply Voltage-Max (Vsup) 1.13V
Supply Voltage-Min (Vsup) 1.07V
Number of I/O MCU - 208, FPGA - 250
Speed 925MHz
RAM Size 64KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA, POR, WDT
Clock Frequency 670MHz
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 462K Logic Elements
Dimensions
Height Seated (Max) 2.7mm
Length 31mm
Width 31mm
Compliance
RoHS Status RoHS Compliant
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