5ASXMB3E4F31I5N
RoHS 
RoHS compliant
RoHS compliantPackage 896-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 64KB 622MHz 1.1V
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Technical Details
Supply Chain
Factory Lead Time 8 Weeks
Physical
Package / Case 896-BBGA, FCBGA
Surface Mount YES
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria V SX
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number 5ASXMB3
JESD-30 Code S-PBGA-B896
Supply Voltage-Max (Vsup) 1.13V
Supply Voltage-Min (Vsup) 1.07V
Number of I/O MCU - 208, FPGA - 250
Speed 800MHz
RAM Size 64KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA, POR, WDT
Clock Frequency 622MHz
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 350K Logic Elements
Dimensions
Height Seated (Max) 2.7mm
Length 31mm
Width 31mm
Compliance
RoHS Status RoHS Compliant
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