1SX085HN3F43I3VG
RoHS
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Package 1760-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)
Description
MCU FPGA Active Quad ARM? Cortex?-A53MPCore? with CoreSight? FPGA - 850K Logic Elements System On Chip (SOC) IC -40C~100C TJ 256KB 1.5GHz
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Technical Details
Supply Chain
Factory Lead Time 12 Weeks
Physical
Package / Case 1760-BBGA, FCBGA
Technical
Operating Temperature -40°C~100°C TJ
Series Stratix? 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 1.5GHz
RAM Size 256KB
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 850K Logic Elements
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