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MPC885CZP133

NXP USA Inc.
RoHS
/
Package 357-BBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description 32-BIT MICROPROCESSOR-MPU, 133MHZ, BGA-357; Product Range:4731538 Series; MPU Core Size:32bit; Program Memory Size:16KB; No. of Pins:357; MPU Case Style:BGA; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; CPU Speed:133MHz ;RoHS Compliant: No
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Technical Details

Compliance

RoHS Status Non-RoHS Compliant

Dimensions

Length 25mm
Height Seated (Max) 2.52mm

Technical

Security Features Cryptography
Co-Processors/DSP Communications; CPM, Security; SEC
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
USB USB 2.0 (1)
RAM Controllers DRAM
Graphics Acceleration No
Number of Cores/Bus Width 1 Core 32-Bit
Ethernet 10Mbps (3), 10/100Mbps (2)
Voltage - I/O 3.3V
Integrated Cache YES
Format FIXED POINT
External Data Bus Width 32
Low Power Mode YES
Boundary Scan YES
Address Bus Width 32
Bit Size 32
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Speed 133MHz
Supply Voltage-Min (Vsup) 1.7V
Power Supplies 1.83.3V
Supply Voltage-Max (Vsup) 1.9V
JESD-30 Code S-PBGA-B357
Base Part Number MPC885
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1.27mm
Supply Voltage 1.8V
Peak Reflow Temperature (Cel) 245
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Microprocessors
HTS Code 8542.31.00.01
Terminal Finish Tin/Lead (Sn/Pb)
ECCN Code 5A002.A.1
Number of Terminations 357
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e0
Series MPC8xx
Published 1999
Packaging Tray
Operating Temperature -40°C~100°C TA

Physical

Surface Mount YES
Package / Case 357-BBGA

Supply Chain

Factory Lead Time 12 Weeks

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