MPC857TZQ66B
RoHS
/
Package 357-BBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
Microprocessors - MPU POWER QUICC
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Technical Details
Compliance
RoHS Status Non-RoHS Compliant
Dimensions
Length 25mm
Height Seated (Max) 2.52mm
Technical
Co-Processors/DSP Communications; CPM
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
RAM Controllers DRAM
Graphics Acceleration No
Number of Cores/Bus Width 1 Core 32-Bit
Ethernet 10Mbps (1), 10/100Mbps (1)
Voltage - I/O 3.3V
Integrated Cache YES
Format FIXED POINT
External Data Bus Width 32
Low Power Mode YES
Boundary Scan YES
Address Bus Width 32
Bit Size 32
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Speed 66MHz
Supply Voltage-Min (Vsup) 3.135V
Supply Voltage-Max (Vsup) 3.465V
JESD-30 Code S-PBGA-B357
Base Part Number MPC857
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1.27mm
Supply Voltage 3.3V
Peak Reflow Temperature (Cel) 245
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.31.00.01
Terminal Finish Tin/Lead (Sn/Pb)
ECCN Code 5A991
Number of Terminations 357
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e0
Series MPC8xx
Published 2004
Packaging Tray
Operating Temperature 0°C~105°C TA
Physical
Surface Mount YES
Package / Case 357-BBGA
Alternative Model
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