MCIMX6QP4AVT1AB
RoHS 
RoHS compliant
RoHS compliantPackage 624-FBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
I.MX 6QP ROM PERF ENHAN
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Technical Details
Supply Chain
Factory Lead Time 12 Weeks
Physical
Package / Case 624-FBGA, FCBGA
Surface Mount YES
Technical
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series i.MX6QP
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 624
SATA SATA 3Gbps (1)
Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Co-Processors/DSP Multimedia; NEON? SIMD
Additional Interfaces CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
RAM Controllers LPDDR2, DDR3L, DDR3
Graphics Acceleration Yes
Number of Cores/Bus Width 4 Core 32-Bit
Ethernet 10/100/1000Mbps (1)
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Core Processor ARM? Cortex?-A9
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Speed 1.0GHz
Supply Voltage-Min (Vsup) 1.35V
Supply Voltage-Max (Vsup) 1.5V
JESD-30 Code S-PBGA-B624
Time@Peak Reflow Temperature-Max (s) 40
Terminal Pitch 0.8mm
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.31.00.01
Compliance
RoHS Status ROHS3 Compliant
Dimensions
Length 21mm
Height Seated (Max) 2.16mm
Alternative Model
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