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MCIMX6Q4AVT10AER

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 624-FBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description I.MX6Q ROM PERF ENHAN
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Technical Details

Supply Chain

Factory Lead Time 14 Weeks

Physical

Package / Case 624-FBGA, FCBGA

Technical

Operating Temperature -40°C~125°C TJ
Packaging Tape & Reel (TR)
Published 2002
Series i.MX6Q
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Speed 1.0GHz
Core Processor ARM? Cortex?-A9
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 4 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (4)
Additional Interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON? SIMD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD
SATA SATA 3Gbps (1)

Compliance

RoHS Status ROHS3 Compliant

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