MCIMX6L3DVN10AC
RoHS 
RoHS compliant
RoHS compliantPackage 432-TFBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
I.MX 6SL ROM PERF ENHAN
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Technical Details
Compliance
RoHS Status ROHS3 Compliant
Dimensions
Length 13mm
Height Seated (Max) 1.1mm
Technical
Display & Interface Controllers Keypad, LCD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Co-Processors/DSP Multimedia; NEON? SIMD
Additional Interfaces AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
USB USB 2.0 + PHY (3)
RAM Controllers LPDDR2, LVDDR3, DDR3
Graphics Acceleration Yes
Number of Cores/Bus Width 1 Core 32-Bit
Ethernet 10/100Mbps (1)
Voltage - I/O 1.2V 1.8V 3.0V
Core Processor ARM? Cortex?-A9
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Speed 1.0GHz
Supply Voltage-Min (Vsup) 1.375V
Supply Voltage-Max (Vsup) 1.5V
JESD-30 Code S-PBGA-B
Time@Peak Reflow Temperature-Max (s) 40
Terminal Pitch 0.5mm
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
HTS Code 8542.31.00.01
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
Series i.MX6SL
Published 2017
Packaging Tray
Operating Temperature 0°C~95°C TJ
Physical
Surface Mount YES
Package / Case 432-TFBGA
Supply Chain
Factory Lead Time 15 Weeks
Alternative Model
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