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MCIMX6D4AVT10AE

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 624-FBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description ROHS3Compliant USB 2.0 + PHY (4) LPDDR2LVDDR3DDR3 2002 IC Microprocessor -40C~125C TJ 1.8V 2.5V 2.8V 3.3V 1.0GHz 10/100/1000Mbps (1)
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Technical

SATA SATA 3Gbps (1)
Display & Interface Controllers Keypad, LCD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Co-Processors/DSP Multimedia; NEON? SIMD
Additional Interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
USB USB 2.0 + PHY (4)
RAM Controllers LPDDR2, LVDDR3, DDR3
Graphics Acceleration Yes
Number of Cores/Bus Width 2 Core 32-Bit
Ethernet 10/100/1000Mbps (1)
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Core Processor ARM? Cortex?-A9
Speed 1.0GHz
Time@Peak Reflow Temperature-Max (s) 40
Peak Reflow Temperature (Cel) 260
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
Series i.MX6D
Published 2002
Packaging Tray
Operating Temperature -40°C~125°C TJ

Physical

Package / Case 624-FBGA, FCBGA

Supply Chain

Factory Lead Time 12 Weeks

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