MC68EN360CVR25L
RoHS 
RoHS compliant
RoHS compliantPackage 357-BBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
Microprocessors - MPU QUICC ETHRN
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Technical Details
Supply Chain
Factory Lead Time 8 Weeks
Physical
Package / Case 357-BBGA
Surface Mount YES
Technical
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 1995
Series M683xx
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC68EN360
JESD-30 Code S-PBGA-B357
Speed 25MHz
uPs/uCs/Peripheral ICs Type RISC MICROCONTROLLER
Core Processor CPU32+
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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