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MC68360VR25L

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 357-BBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25)
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Technical Details

Supply Chain

Factory Lead Time 8 Weeks

Physical

Package / Case 357-BBGA
Surface Mount YES

Technical

Operating Temperature 0°C~70°C TA
Packaging Tray
Published 1995
Series M683xx
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC68360
JESD-30 Code S-PBGA-B357
Supply Voltage-Max (Vsup) 5.25V
Supply Voltage-Min (Vsup) 4.75V
Speed 25MHz
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Core Processor CPU32+
Clock Frequency 25MHz
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
Bus Compatibility MC68040; MC68030
Data Transfer Rate-Max 1.25 MBps
Communication Protocol BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP
Data Encoding/Decoding Method NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL

Dimensions

Height Seated (Max) 1.86mm
Length 25mm

Compliance

RoHS Status ROHS3 Compliant

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