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LS1046ASE8MQA

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 780-FBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description ROHS3Compliant USB 3.0 (3) + PHY BALL DDR4 IC Microprocessor 0C~105C 23mm 0.87V 1.2GHz
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Length 23mm
Height Seated (Max) 2.61mm

Technical

SATA SATA 6Gbps (1)
Security Features Secure Boot, TrustZone?
Bus Compatibility I2C, PCI, SPI, UART, USB
USB USB 3.0 (3) + PHY
RAM Controllers DDR4
Number of Cores/Bus Width 4 Core 64-Bit
Ethernet 10GbE (2), 2.5GbE (1), 1GbE (4)
External Data Bus Width 64
Boundary Scan YES
Address Bus Width 14
Core Processor ARM? Cortex?-A72
Speed 1.2GHz
Number of I/O 76
Supply Voltage-Min (Vsup) 0.87V
Supply Voltage-Max (Vsup) 0.93V
JESD-30 Code S-PBGA-B780
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 0.8mm
Supply Voltage 0.9V
Peak Reflow Temperature (Cel) 250
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Number of Terminations 780
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
Series QorIQ? Layerscape
Published 2016
Packaging Tray
Operating Temperature 0°C~105°C

Physical

Surface Mount YES
Package / Case 780-FBGA, FCBGA

Supply Chain

Factory Lead Time 18 Weeks

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