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LS1023AXN8MQB

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 780-FBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description ROHS3Compliant USB 3.0 (2) + PHY DDR3L DDR4 2014 IC Microprocessor -40C~105C 1.2GHz 1GbE (7) or 10GbE (1) & 1GbE (5)
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Technical Details

Supply Chain

Factory Lead Time 18 Weeks

Physical

Package / Case 780-FBGA, FCBGA

Technical

Operating Temperature -40°C~105°C
Packaging Tray
Published 2014
Series QorIQ? Layerscape
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 1.2GHz
Core Processor ARM? Cortex?-A53
Ethernet 1GbE (7) or 10GbE (1) & 1GbE (5)
Number of Cores/Bus Width 2 Core 64-Bit
RAM Controllers DDR3L, DDR4
USB USB 3.0 (2) + PHY
Security Features Secure Boot, TrustZone?
SATA SATA 6Gbps (1)

Compliance

RoHS Status ROHS3 Compliant

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