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LS1022ASE7EKB

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 525-FBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description ROHS3Compliant USB 2.0 (1) DDR3L DDR4 2002 IC Microprocessor 0C~105C 600MHz GbE (2)
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Technical Details

Supply Chain

Factory Lead Time 18 Weeks

Physical

Package / Case 525-FBGA, FCBGA

Technical

Operating Temperature 0°C~105°C
Packaging Tray
Published 2002
Series QorIQ? Layerscape
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 600MHz
Core Processor ARM? Cortex?-A7
Ethernet GbE (2)
Number of Cores/Bus Width 2 Core 32-Bit
RAM Controllers DDR3L, DDR4
USB USB 2.0 (1)
Co-Processors/DSP Multimedia; NEON? SIMD
Security Features Secure Boot, TrustZone?
SATA SATA 3Gbps (1)

Compliance

RoHS Status ROHS3 Compliant

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