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BSC9131NLE7HHHB

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 520-FBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description ROHS3Compliant USB 2.0 (1) DDR3DDR3L Signal Processing; SC3850Security; SEC 4.4 IC Microprocessor 0C~105C 1.8V 2.5V 3.3V 800MHz 10/100/1000Mbps (2)
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Technical Details

Technical

Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 800MHz
Core Processor PowerPC e500
Voltage - I/O 1.8V 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR3, DDR3L
USB USB 2.0 (1)
Additional Interfaces AIC, DUART, I2C, MMC/SD, SPI, USIM
Co-Processors/DSP Signal Processing; SC3850, Security; SEC 4.4
Security Features Boot Security, Cryptography, Random Number Generator
Series QorIQ Qonverge BSC
Operating Temperature 0°C~105°C

Compliance

RoHS Status ROHS3 Compliant

Physical

Package / Case 520-FBGA, FCBGA

Supply Chain

Factory Lead Time 26 Weeks

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