PCX755BVZFU300LE
RoHS
/
Package 360-BBGA Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
IC MPU POWERPC 300MHZ 360BGA
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Technical Details
Physical
Package / Case 360-BBGA Exposed Pad
Supplier Device Package 360-PBGA (25x25)
Technical
Operating Temperature -40°C~110°C TJ
Packaging Tray
Published 2006
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PCX755
Speed 300MHz
Core Processor PowerPC
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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