XPC850DEZT66BU
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
FIXED POINT MICROPROCESSOR RISC Not Qualified BALL IC Microprocessor 95C 23mm 3.3V 66MHz
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Technical Details
Physical
Package / Case BGA
Surface Mount YES
Technical
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 256
Terminal Finish TIN LEAD
Max Operating Temperature 95°C
Min Operating Temperature 0°C
Subcategory Microprocessors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 3.3V
Reach Compliance Code not_compliant
Frequency 66MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 3.3V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Halogen Free Not Halogen Free
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Number of Cores 1
Dimensions
Height Seated (Max) 2.35mm
Length 23mm
Width 23mm
Compliance
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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