XPC850DEVR50BU
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
FIXED POINT MICROPROCESSOR RISC Not Qualified BALL IC Microprocessor 95C 23mm 3.3V 32b
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Technical Details
Physical
Package / Case BGA
Surface Mount YES
Number of Pins 256
Technical
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 95°C
Min Operating Temperature 0°C
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Frequency 50MHz
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Frequency (Max) 50MHz
Data Bus Width 32b
Halogen Free Not Halogen Free
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Number of Cores 1
Dimensions
Height Seated (Max) 2.35mm
Length 23mm
Compliance
RoHS Status RoHS Compliant
Lead Free Lead Free
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