XPC850DECZT66BU
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
CMOS MICROPROCESSOR RISC BOTTOM BALL IC Microprocessor 95C 23mm 3.465V 66MHz
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Technical Details
Compliance
Lead Free Contains Lead
RoHS Status RoHS Compliant
Dimensions
Width 23mm
Length 23mm
Height Seated (Max) 2.35mm
Technical
Number of Cores 1
Integrated Cache YES
Format FIXED POINT
External Data Bus Width 32
Low Power Mode YES
Boundary Scan YES
Address Bus Width 26
Halogen Free Not Halogen Free
Bit Size 32
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Power Supplies 3.3V
Supply Voltage-Max (Vsup) 3.465V
Qualification Status Not Qualified
Pin Count 256
Time@Peak Reflow Temperature-Max (s) 30
Frequency 66MHz
Supply Voltage 3.3V
Peak Reflow Temperature (Cel) 220
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Microprocessors
Min Operating Temperature -40°C
Max Operating Temperature 95°C
Terminal Finish TIN LEAD
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e0
Physical
Surface Mount YES
Package / Case BGA
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