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Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description FLOATING POINT MICROPROCESSOR BOTTOM BALL IC Microprocessor 105C 33mm 1.045V 32b
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Technical Details

Physical

Package / Case BGA
Surface Mount YES
Number of Pins 1023
Weight 12.834991g

Technical

Packaging Bulk
JESD-609 Code e2
Moisture Sensitivity Level (MSL) 3
Terminal Finish Tin/Silver (Sn/Ag)
Max Operating Temperature 105°C
Min Operating Temperature 0°C
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 1.1V
Terminal Pitch 1mm
Frequency 1.333GHz
Supply Voltage-Max (Vsup) 1.155V
Supply Voltage-Min (Vsup) 1.045V
Speed 1333 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR
Bit Size 32
Frequency (Max) 1.333GHz
Data Bus Width 32b
Halogen Free Not Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
Format FLOATING POINT
Integrated Cache YES
Number of Cores 2

Dimensions

Height Seated (Max) 3.38mm
Length 33mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

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