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Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description FLOATING POINT MICROPROCESSOR BOTTOM BALL IC Microprocessor 105C 29mm 1.1V 32b
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Technical Details

Physical

Package / Case BGA
Surface Mount YES
Number of Pins 783
Weight 11.529496g

Technical

JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 783
ECCN Code 5A002
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature 105°C
Min Operating Temperature 0°C
Subcategory Microprocessors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.1V
Frequency 1.2GHz
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 783
Operating Supply Voltage 1.1V
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type MICROPROCESSOR
Bit Size 32
Frequency (Max) 1.2GHz
Data Bus Width 32b
Halogen Free Halogen Free
Address Bus Width 64
Boundary Scan YES
Low Power Mode YES
Format FLOATING POINT
Integrated Cache YES
Number of Cores 1

Dimensions

Height Seated (Max) 3.38mm
Length 29mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

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