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Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description FLOATING POINT MICROPROCESSOR BOTTOM BALL IC Microprocessor 105C 29mm 1V 32b
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Technical Details

Physical

Package / Case BGA
Surface Mount YES
Number of Pins 783
Weight 3.534392g

Technical

JESD-609 Code e2
Moisture Sensitivity Level (MSL) 3
Number of Terminations 783
ECCN Code 5A992
Terminal Finish Tin/Silver (Sn/Ag)
Max Operating Temperature 105°C
Min Operating Temperature 0°C
Subcategory Microprocessors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Frequency 1.067GHz
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 783
Operating Supply Voltage 1V
Speed 533 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR
Bit Size 32
Frequency (Max) 33.3MHz
Data Bus Width 32b
Halogen Free Not Halogen Free
Number of Timers/Counters 4
Address Bus Width 32
Boundary Scan YES
Low Power Mode NO
Format FLOATING POINT
Integrated Cache YES
Number of Cores 1

Dimensions

Height Seated (Max) 2.8mm
Length 29mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

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