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Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
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Inventory: 4969
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Technical Details

Physical

Package / Case BGA
Surface Mount YES
Number of Pins 256

Technical

Packaging Bulk
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3
Number of Terminations 256
ECCN Code 5A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 95°C
Min Operating Temperature 0°C
Additional Feature ALSO REQUIRES 3.3V SUPPLY
HTS Code 8542.31.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9V
Power Supplies 1.83.3V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Frequency (Max) 50MHz
Access Time 50 μs
Data Bus Width 32b
Halogen Free Not Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES

Dimensions

Height Seated (Max) 2.54mm
Length 23mm

Compliance

RoHS Status RoHS Compliant
Lead Free Contains Lead

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